Home > Equipment Detail
| ID | Function | OEM | Model | Description | Qty |
Price | Status |
| 3599 | Wafer Geometry Gauge | E+H (Eichhorn + Hausmann ) | MX 208 | * 晶圓表面檢查, 檢查晶圓表面厚度, 平坦度 * For 8"Wafer. 全自動. * Contactless distance measurement using capacitive sensors * Resolution 0.1 micronmeters * Mathematical simulation of a vacuum chuck * Measuring time per wafer: max. 15 secs * Wafer at rest during measurement * Serial interface RS232 * Evaluation- and data base software for PCs included * Automatic data conversion (ASC II/ dBase III) * Quick and easy recalibration |
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Contact for this equipment: sales@semicon-equip.com
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